The new HiperLCS-2 chipset (HiperLCS2-HB power device + HiperLCS2-SR isolation device) brings Power Integrations’ unique 600 V FREDFETs and magneto-inductive FluxLink technology to the LLC topology. The result is 98% efficiency and 40% component-count reduction in LLC resonant power converters up to 250 W.

Vice President of Marketing Doug Bailey explains.